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| November 2006 Cover Page HYS72T64400HFD-[3S/3.7]-A HYS72T128420HFD-[3S/3.7]-A HYS72T256420HFD-[3S/3.7]-A 240-Pin Fully-Buffered DDR2 SDRAM Modules DDR2 SDRAM RoHS Compliant Products Internet Data Sheet Rev. 1.2 Internet Data Sheet HYS72T[64/128/256]4[00/20]HFD-[3S/3.7]-A Revision History Revision History: Rev. 1.2, 2006-11-27 All Page 19 All Adapted internet edition Updated "Current Spec. and Conditions" on Page 19 Converted to qimonda template Previous Revision: Rev. 1.1, 2006-09-26 We Listen to Your Comments We Listen to Your Comments Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will help us to continuously improve the quality of this document. Please send your proposal (including a reference to this document) to: techdoc@qimonda.com qag_techdoc_rev400 / 3.2 QAG / 2006-07-21 03292006-GUME-ERC3 2 Internet Data Sheet HYS72T[64/128/256]4[00/20]HFD-[3S/3.7]-A 1 1.1 Overview Features * Detects errors on the channel and reports them to the host memory controller. * Automatic DDR2 DRAM Bus Calibration. * Automatic Channel Calibration. * Full Host Control of the DDR2 DRAMs. * Over-Temperature Detection and Alert. * Hot Add-on and Hot Remove Capability. * MBIST and IBIST Test Functions. * Transparent Mode for DRAM Test Support. * Low profile: 133.35mm x 30.35 mm * 240 Pin gold plated card connector with 1.00mm contact centers (JEDEC standard pending). * Based on JEDEC standard reference card designs (Jedec standard pending). * SPD (Serial Presence Detect) with 256 Byte serial E2PROM.Performance: * RoHS Compliant Products1) This chapter describes the main characteristics of the 240-Pin Fully-Buffered DDR2 SDRAM Modules product family. * 240-pin Fully-Buffered ECC Dual-In-Line DDR2 SDRAM Module for PC, Workstation and Server main memory applications. * Module organisation one rank 64M x72, one rank 128M x72, two ranks 128M x72, two ranks 256M x72 * JEDEC Standard Double Data Rate 2 Synchronous DRAMs (DDR2 SDRAMs) with 1.8 V ( 0.1 V) power supply. * Built with 512Mb DDR2 SDRAMs in 60-ball FBGA Chipsize Packages. * Re-drive and re-sync of all address, command, clock and data signals using AMB (Advanced Memory Buffer). * High-Speed Differential Point-to-Point Link Interface at 1.5 V (Jedec standard pending). * Host Interface and AMB component industry standard compliant. * Supports SMBus protocol interface for access to the AMB configuration registers. TABLE 1 Performance for DDR2-667 and DDR2-533 Product Type Speed Code Speed Grade max. Clock Frequency @CL5 @CL4 @CL3 min. RAS-CAS-Delay min. Row Precharge Time min. Row Active Time min. Row Cycle Time -3S PC2-5300 5-5-5 -3.7 PC2-4200 4-4-4 266 266 200 15 15 45 60 Unit -- MHz MHz MHz ns ns ns ns fCK5 fCK4 fCK3 tRCD tRP tRAS tRC 333 266 200 15 15 45 60 1) RoHS Compliant Product: Restriction of the use of certain hazardous substances (RoHS) in electrical and electronic equipment as defined in the directive 2002/95/EC issued by the European Parliament and of the Council of 27 January 2003. These substances include mercury, lead, cadmium, hexavalent chromium, polybrominated biphenyls and polybrominated biphenyl ethers. Rev. 1.2, 2006-11 03292006-GUME-ERC3 3 Internet Data Sheet HYS72T[64/128/256]4[00/20]HFD-[3S/3.7]-A 1.2 Description DIMMs on a system board using an Industry Standard HighSpeed Differential Point-to-Point Link Interface at 1.5 V. The Advanced Memory Buffer also allows buffering of memory traffic to support large memory capacities. All memory control for the DRAM resides in the host, including memory request initiation, timing, refresh, scrubbing, sparing, configuration access, and power management. The Advanced Memory Buffer interface is responsible for handling channel and memory requests to and from the local DIMM and for forwarding requests to other DIMMs on the memory channel. Fully Buffered DIMM provides a high memory bandwidth, large capacity channel solution that has a narrow host interface. The maximum memory capacity is 288 DDR2 SDRAM devices per channel or 8 DIMMs. This document describes the electrical and mechanical features of a 240-pin, PC2-4200F, PC2-5300F ECC type, Fully Buffered Double-Data-Rate Two Synchronous DRAM Dual In-Line Memory Modules (DDR2 SDRAM FB-DIMMs). Fully Buffered DIMMs use commodity DRAMs isolated from the memory channel behind a buffer on the DIMM. They are intended for use as main memory when installed in systems such as servers and workstations. PC2-4200, PC2-5300 refers to the DIMM naming convention indicating the DDR2 SDRAMs running at 266, 333 MHz clock speed and offering 4200, 5300 MB/s peak bandwidth. FB-DIMM features a novel architecture including the Advanced Memory Buffer. This single chip component, located in the center of each DIMM, acts as a repeater and buffer for all signals and commands which are exchanged between the host controller and the DDR2 SDRAMs including data in- and output. The AMB communicates with the host controller and / or the adjacent TABLE 2 Ordering Information (Pb-free components and assembly) Product Type1) PC2-4200F (DDR2-533): HYS72T64400HFD-3.7-A HYS72T128420HFD-3.7-A HYS72T256420HFD-3.7-A PC2-5300F (DDR2-667): HYS72T64400HFD-3S-A HYS72T128420HFD-3S-A HYS72T256420HFD-3S-A 512MB 1Rx8 PC2-4200F-444-11-A PC2-4200F-444-11-B 2GB 2Rx4 PC2-4200F-444-11-H 1 Rank, FB-DIMM 2 Ranks, FB-DIMM 2 Ranks, FB-DIMM 512 Mbit (x8) 512 Mbit (x8) 512 Mbit (x4) 512MB 1Rx8 PC2-4200F-444-11-A 1GB 2Rx8 PC2-4200F-444-11-B 2GB 2Rx4 PC2-4200F-444-11-H 1 Rank, FB-DIMM 2 Ranks, FB-DIMM 2 Ranks, FB-DIMM 512 Mbit (x8) 512 Mbit (x8) 512 Mbit (x4) Compliance Code2) Description SDRAM Technology 1) All product types end with a place code, designating the silicon die revision. Example: HYS 72T64000HFA-3.7-A, indicating Rev. A dice are used for DDR2 SDRAM components. To learn more on QIMONDA DDR2 module and component nomenclature see section 8 of this datasheet. 2) The Compliance Code is printed on the module label and describes the speed grade, e.g. "PC2-4200F-444-11-A", where 4200F means Fully Buffered DIMM with 4.26 GB/sec. Module Bandwidth and "444-11" means CAS latency = 4, trcd latency = 4 and trp latency = 4 using JEDEC SPD Revision 1.1 and assembled on Raw Card "A". Rev. 1.2, 2006-11 03292006-GUME-ERC3 4 Internet Data Sheet HYS72T[64/128/256]4[00/20]HFD-[3S/3.7]-A TABLE 3 Address Format DIMM Density 512 MB 1 GB 2 GB Module Organization 64M x72 128M x72 256M x72 Memory Ranks 1 2 2 ECC/ Non-ECC ECC ECC ECC # of SDRAMs 9 18 36 # of row/bank/columns bits 13/2/10 13/2/10 13/2/11 Raw Card A B H TABLE 4 Components on Modules Product Type HYS72T64000HF HYS72T128020HF HYS72T256020HF DRAM components1) HYB18T512800AF HYB18T512800AF HYB18T512400AF DRAM Density 512 Mbit 512 Mbit 512 Mbit DRAM Organisation 64M x8 64M x8 128M x4 Note2) 1) Green Product 2) For a detailed description of all functionalities of the DRAM components on these modules see the component datasheet. Rev. 1.2, 2006-11 03292006-GUME-ERC3 5 Internet Data Sheet HYS72T[64/128/256]4[00/20]HFD-[3S/3.7]-A 2 Pin Configuration The pin configuration of the DDR2 SDRAM DIMM is listed by function in Table 5 (240 pins). The abbreviations used in columns Pin and Buffer Type are explained in Table 6 and Table 7 respectively. The pin numbering is depicted in Figure 1. TABLE 5 Pin Configuration of FB-DIMM Pin# Clock Signals 228 229 Control Signals 17 Northbound 22 25 28 31 34 37 51 54 57 60 63 66 48 40 23 26 29 32 35 38 52 55 58 61 64 PN0 PN1 PN2 PN3 PN4 PN5 PN6 PN7 PN8 PN9 PN10 PN11 PN12 PN13 PN0 PN1 PN2 PN3 PN4 PN5 PN6 PN7 PN8 PN9 PN10 O O O O O O O O O O O O O O O O O O O O O O O O O HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 Primary Northbound Data, positive lines RESET I LV-CMOS AMB reset signal SCK SCK I I HSDL_15 HSDL_15 System Clock Input, positive line System Clock Input, negative line Name Pin Type Buffer Type Function Rev. 1.2, 2006-11 03292006-GUME-ERC3 6 Internet Data Sheet HYS72T[64/128/256]4[00/20]HFD-[3S/3.7]-A Pin# 67 49 41 142 145 148 151 154 157 171 174 177 180 183 186 168 160 143 146 149 152 155 158 172 175 178 181 184 187 169 161 Southbound 70 73 76 79 82 93 96 99 Name PN11 PN12 PN13 SN0 SN1 SN2 SN3 SN4 SN5 SN6 SN7 SN8 SN9 SN10 SN11 SN12 SN13 SN0 SN1 SN2 SN3 SN4 SN5 SN6 SN7 SN8 SN9 SN10 SN11 SN12 SN13 PS0 PS1 PS2 PS3 PS4 PS5 PS6 PS7 Pin Type O O O I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I Buffer Type HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 Function Secondary Northbound Data, positive lines Primary Southbound Data, positive lines Rev. 1.2, 2006-11 03292006-GUME-ERC3 7 Internet Data Sheet HYS72T[64/128/256]4[00/20]HFD-[3S/3.7]-A Pin# 102 90 71 74 77 80 83 94 97 100 103 91 190 193 196 199 202 213 216 219 222 210 191 194 197 200 203 214 217 220 223 211 EEPROM 120 119 239 240 118 Name PS8 PS9 PS0 PS1 PS2 PS3 PS4 PS5 PS6 PS7 PS8 PS9 SS0 SS1 SS2 SS3 SS4 SS5 SS6 SS7 SS8 SS9 SS0 SS1 SS2 SS3 SS4 SS5 SS6 SS7 SS8 SS9 SCL SDA SA0 SA1 SA2 Pin Type I I I I I I I I I I I I O O O O O O O O O O O O O O O O O O O O I I/O I I I Buffer Type HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 HSDL_15 CMOS OD CMOS CMOS CMOS Function Primary Southbound Data, negative lines Secondary Southbound data, positive lines Secondary Southbound data, negative lines Serial Bus Clock Serial Bus Data Serial Address Select Bus 2:0 Rev. 1.2, 2006-11 03292006-GUME-ERC3 8 Internet Data Sheet HYS72T[64/128/256]4[00/20]HFD-[3S/3.7]-A Pin# Power Supplies 238 9,10,12,13,129,130,132,133 15,117,135,237 Name Pin Type PWR PWR PWR PWR Buffer Type - - - - Function VDDSPD VCC VTT EEPROM Power Supply AMB Core Power / Channel Interface Power Address/Command/Clock Termination Power Power Supply 1,2,3,5,6,7,108,109,111,112,113,115 VDD ,116,121,122,123,125,126, 127,231,232,233,235,236 4,8,11,14,18,21,24,27,30,33,36, 39,42,43,46,47,50,53,56,59,62, 65,68,69,72,75,78,81,84,85,88, 89,92,95,98,101,104,107,110, 114,124,128,131,134,138,141, 144,147,150,153,156,159,162, 163,166,167,170,173,176,179, 182,185,188,189,192,195,198, 201,204,205,208,209,212,215, 218,221,224,227,230,234 Other Pins 19,20,44,45,86,87,105,106,139, 140,164,165,206,207,225,226 136 16 137 RFU VID0 VID1 Test VSS GND - Ground Plane NC - - AI - - - - Not connected Voltage ID VREF TABLE 6 Abbreviations for Buffer Type Abbreviation HSDL_15 LV-CMOS CMOS OD Description High-Speed Differential Point-to-Point Link Interface at 1.5 V Low Voltage CMOS CMOS Levels Open Drain. The corresponding pin has 2 operational states, active low and tristate, and allows multiple devices to share as a wire-OR. Rev. 1.2, 2006-11 03292006-GUME-ERC3 9 Internet Data Sheet HYS72T[64/128/256]4[00/20]HFD-[3S/3.7]-A TABLE 7 Abbreviations for Pin Type Abbreviation I O I/O AI PWR GND NU NC Description Standard input-only pin. Digital levels. Output. Digital levels. I/O is a bidirectional input/output signal. Input. Analog levels. Power Ground Not Usable Not Connected Rev. 1.2, 2006-11 03292006-GUME-ERC3 10 Internet Data Sheet HYS72T[64/128/256]4[00/20]HFD-[3S/3.7]-A FIGURE 1 Pin Configuration for FB-DIMM (240 pin) Rev. 1.2, 2006-11 03292006-GUME-ERC3 11 Internet Data Sheet HYS72T[64/128/256]4[00/20]HFD-[3S/3.7]-A 3 3.1 Basic Functionality Advanced Memory Buffer Functionality * Detects errors on the channel and reports them to the host memory controller. * Support the FB-DIMM configuration register set as defined in the register chapters. * Acts as DRAM memory buffer for all read, write, and configuration accesses addressed to the DIMM. * Provides a read buffer FIFO and a write buffer FIFO. * Supports an SMBus protocol interface for access to the AMB configuration registers. * Provides logic to support MEMBIST and IBIST Design for Test functions. * Provides a register interface for the thermal sensor and status indicator. * Functions as a repeater to extend the maximum length of FB-DIMM Links. The Advanced Memory Buffer (AMB) reference design complies with the FB-DIMM Architecture and Protocol Specification. The Advanced Memory Buffer will perform the following FBDIMM channel functions: * Supports channel initialization procedures as defined in the initialization chapter of the FB-DIMM Architecture and Protocol Specification to align the clocks and the frame boundaries, verify channel connectivity, and identify AMB DIMM position. * Supports the forwarding of southbound and northbound frames, servicing requests directed to a specific AMB or DIMM, as defined in the protocol chapter, and merging the return data into the northbound frames. * If the AMB resides on the last DIMM in the channel, the AMB initializes northbound frames. Transparent Mode for DRAM Test Support In this mode, the Advanced Memory Buffer will provide lower speed tester access to DRAM pins through the FB-DIMM I/O pins. This allows the tester to send an arbitrary test pattern to the DRAMs. Transparent mode only supports a maximum DRAM frequency equivalent to DDR2 400. Transparent mode functionality: * Reconfigures FB-DIMM inputs from differential high speed link receivers to two single ended lower speed receivers (~200 MHz) * These inputs directly control DDR2 Command/Address and input data that is replicated to all DRAMs * Uses low speed direct drive FB-DIMM outputs to bypass high speed Parallel/Serial circuitry and provide test results back to tester DDR2 SDRAM Interface * Supports DDR2 at speeds of 533, 667MT/s * Supports 256Mb, 512Mb and 1Gb devices in x4 and x8 configurations * 72-bit DDR2 SDRAM memory array 3.2 Interfaces controller or an adjacent FB-DIMM. The DDR2 channel supports direct connection to the DDR2 SDRAMs on a Fully Buffered DIMM. Figure 2 illustrates the Advanced Memory Buffer and all of its interfaces. They consist of two FB-DIMM links, one DDR2 channel and an SMBus interface. Each FB-DIMM link connects the Advanced Memory Buffer to a host memory Rev. 1.2, 2006-11 03292006-GUME-ERC3 12 Internet Data Sheet HYS72T[64/128/256]4[00/20]HFD-[3S/3.7]-A FIGURE 2 Block Diagram Advanced Memory Buffer Interface Interface Topology The FB-DIMM channel uses a daisy-chain topology to provide expansion from a single DIMM per channel to up to 8 DIMMs per channel. The host sends data on the southbound link to the first DIMM where it is received and redriven to the second DIMM. On the southbound data path each DIMM receives the data and again re-drives the data to the next DIMM until the last DIMM receives the data. The last DIMM in the chain initiates the transmission of data in the direction of the host (a.k.a. northbound). On the northbound data path each DIMM receives the data and re-drives the data to the next DIMM until the host is reached. FIGURE 3 Block Diagram of Channel Southbound and Northbound Paths Rev. 1.2, 2006-11 03292006-GUME-ERC3 13 Internet Data Sheet HYS72T[64/128/256]4[00/20]HFD-[3S/3.7]-A 3.3 High-Speed Differential Point-to-Point Link (at 1.5 V) Interfaces read return data or status information that is generated internally. Data and commands sent to the DRAMs travel southbound on 10 primary differential signal line pairs. Data received from the DRAMs and status information travel northbound on 14 primary differential pairs. Data and commands sent to the adjacent DIMM upstream are repeated and travel further southbound on 10 secondary differential pairs. Data and status information received from the adjacent DIMM upstream travel further northbound on 14 secondary differential pairs. The Advanced Memory Buffer supports one FB-DIMM Channel consisting of two bidirectional link interfaces using highspeed differential point-to-point electrical signaling. The southbound input link is 10 lanes wide and carries commands and write data from the host memory controller or the adjacent DIMM in the host direction. The southbound output link forwards this same data to the next FB-DIMM. The northbound input link is 14 lanes wide and carries read return data or status information from the next FB-DIMM in the chain back towards the host. The northbound output link forwards this information back towards the host and multiplexes in any 3.3.1 DDR2 Channel Propagation delays between read data/check-bit strobe lanes on a given channel can differ. Each strobe can be calibrated by hardware state machines using write/read trial and error. Hardware aligns the read data and check-bits to a single core clock. The Advanced Memory Buffer provides four copies of the command clock phase references (CLK[3:0]) and write data/check-bit strobes (DQSs) for each DRAM nibble. The DDR2 channel on the Advanced Memory Buffer supports direct connection to DDR2 SDRAMs. The DDR2 channel supports two ranks of eight banks with 16 row/column request, 64 data, and eight check-bit signals. There are two copies of address and command signals to support DIMM routing and electrical requirements. Four transfer bursts are driven on the data and check-bit lines at 800 MHz. 3.3.2 SMBus Slave Interface to set link strength, frequency and other parameters needed to insure robust configurations. It is also required for diagnostic support when the link is down. The SMBus address straps located on the DIMM connector are used by the unique ID. The Advanced Memory Buffer supports an SMBus interface to allow system access to configuration registers independent of the FB-DIMM link. The Advanced Memory Buffer will never be a master on the SMBus, only a slave. Serial SMBus data transfer is supported at 100 kHz. SMBus access to the Advanced Memory Buffer may be a requirement to boot and 3.3.3 Channel Latency channel. Because the channel is based on the point-to-point interconnection of buffer components between DIMMs, memory requests are required to travel through N-1 buffers before reaching the Nth buffer. The result is that a 4 DIMM channel configuration will have greater idle read latency compared to a 1 DIMM channel configuration. The Variable Read Latency capability can be used to reduce latency for DIMMs closer to the host. The idle latencies listed in this section are representative of what might be achieved in typical AMB designs. Actual implementations with latencies less than the values listed will have higher application performance and vice versa. FB-DIMM channel latency is measured from the time a read request is driven on the FB-DIMM channel pins to the time when the first 16 bytes (2nd chunk) of read completion data is sampled by the memory controller. When not using the Variable Read Latency capability, the latency for a specific DIMM on a channel is always equal to the latency for any other DIMM on that channel. However, the latency for each DIMM in a specific configuration with some number of DIMMs installed may not be equal to the latency for each FB-DIMM in a configuration with some different number of DIMMs installed. As more DIMMs are added to the channel, additional latency is required to read from each DIMM on the Rev. 1.2, 2006-11 03292006-GUME-ERC3 14 Internet Data Sheet HYS72T[64/128/256]4[00/20]HFD-[3S/3.7]-A 3.3.4 Peak Theoretical Channel Throughput from a single channel, or a burst of 4 from two lock-step channels provides a total of 72 bytes of data (64 bytes plus 8 bytes ECC). When the frame rate matches the DRAM command clock, the Southbound command and data connection will exhibit one half the peak theoretical throughput of a single DRAM channel. For example, when using DDR2 533 DRAMs, the peak theoretical bandwidth of the Southbound command and data connection is 2.133 GB/sec. The total peak theoretical throughput for a single FBDIMM channel is defined as the sum of the peak theoretical throughput of the Northbound data connection and the Southbound command and data connection. When the frame rate matches the DRAM command clock, this is equal to 1.5 times the peak theoretical throughput of a single DRAM channel. For example, when using DDR2 533 DRAMs, the peak theoretical throughput of a single DDR2-533 channel would be 4.267 GB/sec., while the peak theoretical throughput of the entire FB-DIMM PC4200F channel would be 6.4GB/sec. An FB-DIMM channel transfers read completion data on the Northbound data connection. 144 bits of data are transferred for every Northbound data frame. This matches the 18-byte data transfer of an ECC DDR DRAM in a single DRAM command clock. A DRAM burst of 8 from a single channel or a DRAM burst of four from two lock stepped channels provides a total of 72 bytes of data (64 bytes plus 8 bytes ECC). The FB-DIMM frame rate matches the DRAM command clock because of the fixed 6:1 ratio of the FB-DIMM channel clock to the DRAM command clock. Therefore, the Northbound data connection will exhibit the same peak theoretical throughput as a single DRAM channel. For example, when using DDR2 533 DRAMs, the peak theoretical bandwidth of the Northbound data connection is 4.267 GB/sec. Write data is transferred on the Southbound command and data connection, via Command+Wdata frames. 72 bits of data are transferred for every Command+Wdata frame. Two Command+Wdata frames match the 18-byte data transfer of an ECC DDR DRAM in a single DRAM command clock. A DRAM burst of 8 transfers 3.4 Hot-add DIMM(s) and perform a Hot-Add Reset to bring them into the channel timing domain. It should be noted that the power to the DIMM socket must be removed before a "hot-add" DIMM is inserted or removed. Applying or removing the power to a DIMM socket is a system platform function. The FB-DIMM channel does not provide a mechanism to automatically detect and report the addition of a new DIMM south of the currently active last DIMM. It is assumed the system will be notified through some means of the addition of one or more new DIMMs so that specific commands can be sent to the host controller to initialize the newly added 3.5 Hot-remove system can coordinate the procedure to remove power in preparation for physical removal of the DIMM if needed. It should be noted that the power to the DIMM socket must be removed before a "hot-add" DIMM is inserted or removed. Applying or removing the power to a DIMM socket is a system platform function. In order to accomplish removal of DIMMs the host must perform a Fast Reset sequence targeted at the last DIMM that will be retained on the channel. The Fast Reset re-establish the appropriate last DIMM so that the Southbound Tx outputs of the last active DIMM and the Southbound and Northbound outputs of the DIMMs beyond the last active DIMM are disabled. Once the appropriate outputs are disabled the 3.6 Hot-replace Hot replace of DIMM is accomplished through combining the Hot-Remove and Hot-Add process. Rev. 1.2, 2006-11 03292006-GUME-ERC3 15 Internet Data Sheet HYS72T[64/128/256]4[00/20]HFD-[3S/3.7]-A 4 4.1 Electrical Characteristics Operating Conditions TABLE 8 Absolute Maximum Ratings Symbol Parameter Rating Min. Max. +2.3 1.75 +2.3 +2.3 +1.75 +100 2.3 V V V V V C V 1)2) 1)2) 1) 1)2) 1) Unit Note VDD VCC VDDQ VDDL VIN, VOUT TSTG VTT Voltage on VDD pin relative to VSS Voltage on VCC pin relative to VSS Voltage on VDDQ pin relative to VSS Voltage on VDDL pin relative to VSS Voltage on any pin relative to VSS Storage Temperature Voltage on VTT pin relative to VSS -0.5 -0,3 -0.5 -0.5 -0.3 -55 -0.5 1) When VDD and VDDQ and VDDL are less than 500 mV; VREF may be equal to or less than 300 mV. 2) Storage Temperature is the case surface temperature on the center/top side of the DRAM. Attention: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. TABLE 9 Operating Temperature Range Symbol Parameter Values Min. Max. +95 +110 C C 1)2)3) 1) Unit Note TCASE TCASE DRAM Component Case Temperature Range AMB Component Case Temperature Range 0 0 1) Within the DRAM Component Case Temperature range all DRAM specification will be supported. 2) Self-Refresh period is hard-coded in the DRAMs and therefore it is imperative that the system ensures the DRAM is below 85 C case temperature before initiating self-refresh operation. 3) Above 85 C DRAM case temperature the Auto-Refresh command interval has to be reduced to tREFI = 3.9 s. Rev. 1.2, 2006-11 03292006-GUME-ERC3 16 Internet Data Sheet HYS72T[64/128/256]4[00/20]HFD-[3S/3.7]-A TABLE 10 Supply Voltage Levels and DC Operating Conditions Parameter Symbol Limit Values Min. AMB Supply Voltage DRAM Supply Voltage Termination Voltage EEPROM Supply Voltage DC Input Logic High(SPD) DC Input Logic Low(SPD) DC Input Logic High(RESET) DC Input Logic Low(RESET) Leakage Current (RESET) Leakage Current (Link) VCC VDD VTT VDDSPD VIH(DC) VIL(DC) VIH(DC) VIL(DC) IL IL 1.455 1.7 0.48 x VDD 3.0 2.1 -- 1.0 -- -90 -5 Nom. 1.5 1.8 0.50 x VDD 3.3 -- -- -- -- -- -- Max. 1.575 1.9 0.52 x VDD 3.6 V V V V V V V V 1) 1) 2) 1) 2) 3) Unit Note VDDSPD 0.8 -- +0.5 +90 +5 1) applies for SMB and SPD Bus Signals. 2) applies for AMB CMOS Signal RESET. 3) for all other AMB related DC parameters, please refer to the High Speed Differential Link Interface Specifications. TABLE 11 Timing Parameters Parameter EI Assertion Pass-Thru Timing EI Deassertion Pass-Thru Timing EI Assertion Duration FBD Cmd to DDR Clk out that latches Cmd FBD Cmd to DDR Write DDR Read to FBD (last DIMM) Resample Pass-Thru time ResynchPass-Thru time Bit Lock Interval Frame Lock Interval Symbol tEI Propagatet tEID tEI -- -- -- -- -- tBitLock tFrameLock Min. -- -- 100 -- -- -- -- -- -- -- Typ. -- -- -- 8.1 TBD 5.0 1.075 2.075 -- -- Max. 4 Bitlock -- -- -- -- -- -- 119 154 Units clks clks clks ns ns ns ns ns frames frames 1) 1) 4) 2) 1)2) 3) Note 1) Defined in FB-DIMM Architecture and Protocol Spec 2) Clocks defined as core clocks = 2x SCK input 3) @ DDR2-667 - measured from beginning of frame at southbound input to DDR clock output that latches the first command of a frame to the DRAMs 4) @ DDR2-667 - measured from latest DQS input to AMB to start of matching data frame at northbound FB-DIMM outputs Rev. 1.2, 2006-11 03292006-GUME-ERC3 17 Internet Data Sheet HYS72T[64/128/256]4[00/20]HFD-[3S/3.7]-A TABLE 12 Environmental Parameters Parameter Operating Temperature Operating Humidity (relative) Storage Temperature Storage Humidity (without condensation) Barometric pressure (operating) Barometric pressure (storage) Symbol TOPR HOPR TSTG HSTG PBAR PBAR Rating See Note 10 to 90 -50 to +100 5 to 95 3050 14240 Units -- % C % m m Note 1) 2) 2) 2) 2) 2) 1) The designer must meet the case temperature specifications for individual module components. 2) Stresses greater than those listed may cause permanent damage to the device. This is a stress rating only and the device funcional operation at or above the conditions indicated is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. Rev. 1.2, 2006-11 03292006-GUME-ERC3 18 Internet Data Sheet HYS72T[64/128/256]4[00/20]HFD-[3S/3.7]-A 5 Current Spec. and Conditions TABLE 13 IDD Measurement Conditions The following table provides an overview of the measurement conditions. Parameter Idle Current, single or last DIMM L0 state, idle (0 BW) Primary channel enabled, Secondary channel disabled CKE high. Command and address lines stable. DRAM clock active Idle Current, first DIMM L0 state, idle (0 BW) Primary and Secondary channels enabled. CKE high. Command and address lines stable. DRAM clock active Active Power L0 state 50% DRAM BW, 67% read, 33% write. Primary and Secondary channels enabled. DRAM clock active, CKE high. Active Power, data pass through L0 state 50% DRAM BW to downstream DIMM, 67% read, 33% write. Primary and Secondary channels enabled. CKE high. Command and address lines stable. DRAM clock active. Training Primary and Secondary channels enabled. 100% toggle on all channels lanes. DRAMs idle (0 BW). CKE high. Command and address lines stable. DRAM clock active. IBIST Over all IBIST modes DRAM Idle (0 BW) Primary channel Enabled Secondary channel Enabled CKE high. Command and Address lines stable DRAM clock active Symbol ICC_Idle_0 IDD_Idle_0 ICC_Idle_1 IDD_Idle_1 ICC_Active_1 IDD_Active_1 ICC_Active_2 IDD_Active_2 ICC_Training IDD_Training ICC_IBIST IDD_IBIST Rev. 1.2, 2006-11 03292006-GUME-ERC3 19 Internet Data Sheet HYS72T[64/128/256]4[00/20]HFD-[3S/3.7]-A Parameter MemBIST Over all MemBIST modes >50% DRAM BW (as dictated by the AMB) Primary channel Enabled Secondary channel Enabled CKE high. Command and Address lines stable DRAM clock active Electrical Idle DRAM Idle (0 BW) Primary channel Disabled Secondary channel Disabled CKE low. Command and Address lines Floated DRAM clock active, ODT and CKE driven low Notes 1. 2. 3. 4. 5. 6. 7. Primary channel Drive strength at 100 % with De-emphasis at -6.5 dB Secondary channel drive strength at 60 % with De-emphasis at -3 dB when enabled. Address and Data fields provide a 50 % toggle rate on DRAM data and link lanes. Burst Length = 4. 10 lanes southbound and 14 lanes northbound are enabled and active (12 lanes NB if non-ECC DIMM). Modeled with 27 termination for command, address, and clocks, and 47 termination for control. Termination is referenced to VTT = VDD / 2. Symbol ICC_MEMBIST IDD_MEMBIST ICC_EI IDD_EI Rev. 1.2, 2006-11 03292006-GUME-ERC3 20 Internet Data Sheet HYS72T[64/128/256]4[00/20]HFD-[3S/3.7]-A 5.1 ICC/IDD Conditions TABLE 14 ICC/IDD Specification for PC2-5300F HYS72T128420HFD-3S-A HYS72T64400HFD-3S-A In the following table you can find the Measurement Conditions and Power Supply Currents1)2) Product Type HYS72T256420HFD-3S-A Unit Note Speed Grade Symbol ICC_Idle_0 PCC_Idle_0 IDD_Idle_0 PDD_Idle_0 ITOT_Idle_0 PTOT_Idle_0 ICC_Idle_1 PCC_Idle_1 IDD_Idle_1 PDD_Idle_1 ITOT_Idle_1 PTOT_Idle_1 ICC_Active_1 PCC_Active_1 IDD_Active_1 PDD_Active_1 PTOT_Active_ 1 ICC_Active_2 PCC_Active_2 IDD_Active_2 PDD_Active_2 PC2-5300F Max. 2.09 3.09 0.73 1.3 2.81 4.38 2.94 4.3 0.72 1.29 3.66 5.59 3.08 4.5 2 3.56 8.05 3 4.48 0.69 1.22 PC2-5300F Max. 2.91 4.28 0.97 1.73 3.88 6.01 2.9 4.25 0.96 1.72 3.86 5.96 3.38 4.44 0.94 4.09 4.32 8.53 3 4.49 0.69 1.22 PC2-5300F Max. 2.09 3.09 1.69 3.02 3.78 6.11 2.94 4.31 1.67 2.97 4.61 7.27 3.1 4.53 3.56 6.3 6.66 10.81 3.06 4.57 1.96 3.45 A W A W A W A W A W A W A W A W A W A W A W ITOT_Active_1 5.07 1) Measured currents on raw card A/B/H/D according to the INTEL/ JEDEC specifcation.The measurements are done in a INTEL Blackford system. 2) The Power is calculated as follows: Pcc = Vcc x Icc where Vcc = 1.5 V Rev. 1.2, 2006-11 03292006-GUME-ERC3 21 Internet Data Sheet HYS72T[64/128/256]4[00/20]HFD-[3S/3.7]-A HYS72T128420HFD-3S-A Speed Grade Symbol PTOT_Active_ 2 ICC_IBIST PCC_IBIST IDD_IBIST PDD_IBIST ITOT_IBIST PTOT_IBIST ICC_Training PCC_Training IDD_Trainig PDD_Training ITOT_Trainig ICC_EI PCC_EI IDD_EI PDD_EI ITOT_EI PTOT_EI PCC_MEMBIS T PDD_MEMBIS T PC2-5300F Max. 5.76 3.43 5.01 0.69 1.23 4.11 6.23 2.99 4.37 0.69 1.23 3.67 2.13 3.13 0.14 0.25 2.26 3.37 4.33 HYS72T64400HFD-3S-A Product Type HYS72T256420HFD-3S-A Unit Note PC2-5300F Max. 3.75 5.75 2.1 4.94 0.17 1.67 2.26 6.61 3.04 4.32 2.3 1.68 5.33 5.98 3.02 3.09 0.69 0.29 3.71 3.38 2.92 4.28 2.2 3.92 5.12 8.19 PC2-5300F Max. 5.09 8.08 3.44 5.01 1.59 2.83 5.02 7.84 2.98 4.35 1.61 2.88 4.59 7.22 2.12 3.11 0.24 0.43 2.35 3.53 2.98 4.35 3.58 6.35 6.56 10.69 A W A W A W A W A W A W A W A W A W A W A W A W A W ITOT_Active_2 3.75 PTOT_Training 5.59 ICC_MEMBIST 2.96 IDD_MEMBIST 1.96 3.49 ITOT_MEMBIS 4.91 T PTOT_MEMBI ST 7.81 Rev. 1.2, 2006-11 03292006-GUME-ERC3 22 Internet Data Sheet HYS72T[64/128/256]4[00/20]HFD-[3S/3.7]-A TABLE 15 ICC/IDD Specification for PC2-4200F HYS72T128420HFD-3.7-A HYS72T64400HFD-3.7-A Product Type HYS72T256420HFD-3.7-A Unit Note Speed Grade Symbol ICC_Idle_0 PCC_Idle_0 IDD_Idle_0 PDD_Idle_0 ITOT_Idle_0 PTOT_Idle_0 ICC_Idle_1 PCC_Idle_1 IDD_Idle_1 PDD_Idle_1 ITOT_Idle_1 PTOT_Idle_1 ICC_Active_1 PCC_Active_1 IDD_Active_1 PDD_Active_1 PTOT_Active_ 1 ICC_Active_2 PCC_Active_2 IDD_Active_2 PDD_Active_2 PTOT_Active_ 2 ICC_IBIST PCC_IBIST IDD_IBIST PC2-4200F Max. 1.78 2.63 0.69 1.24 2.46 3.86 2.51 3.69 0.69 1.23 3.19 4.91 2.65 3.89 2.09 3.71 7.59 2.59 3.88 0.65 1.16 5.1 2.92 4.28 0.65 PC2-4200F Max. 1.75 2.59 0.91 1.62 2.65 4.2 2.49 3.65 0.9 1.61 3.38 5.25 2.88 3.83 0.87 4.16 3.75 7.97 2.59 3.88 0.65 1.15 3.33 5.11 1.69 4.22 0.17 PC2-4200F Max. 1.78 2.63 1.58 2.82 3.35 5.44 2.52 3.7 1.55 2.76 4.06 6.45 2.66 3.91 3.64 6.44 6.3 10.33 2.62 3.94 2.02 3.55 4.74 7.58 2.92 4.28 1.47 A W A W A W A W A W A W A W A W A W A W A W A W A W A ITOT_Active_1 4.73 ITOT_Active_2 3.31 Rev. 1.2, 2006-11 03292006-GUME-ERC3 23 Internet Data Sheet HYS72T[64/128/256]4[00/20]HFD-[3S/3.7]-A HYS72T128420HFD-3.7-A Speed Grade Symbol PDD_IBIST ITOT_IBIST PTOT_IBIST ICC_Training PCC_Training IDD_Trainig PDD_Training ITOT_Trainig ICC_EI PCC_EI IDD_EI PDD_EI ITOT_EI PTOT_EI PCC_MEMBIS T PDD_MEMBIS T PC2-4200F Max. 1.16 3.57 5.44 2.56 3.76 0.65 1.16 3.21 1.71 2.53 0.14 0.24 1.85 2.77 3.72 HYS72T64400HFD-3.7-A Product Type HYS72T256420HFD-3.7-A Unit Note PC2-4200F Max. 1.56 1.85 5.78 2.61 3.71 2.34 1.56 4.94 5.27 2.61 2.5 0.66 0.29 3.26 2.78 2.51 3.68 2.2 3.91 4.7 7.58 PC2-4200F Max. 2.61 4.38 6.89 2.56 3.76 1.47 2.62 4.03 6.38 1.71 2.52 0.24 0.43 1.94 2.95 2.54 3.73 3.4 6.03 5.93 9.74 W A W A W A W A W A W A W A W A W A W A W PTOT_Training 4.92 ICC_MEMBIST 2.54 IDD_MEMBIST 1.95 3.47 ITOT_MEMBIS 4.48 T PTOT_MEMBI ST 7.18 Rev. 1.2, 2006-11 03292006-GUME-ERC3 24 Internet Data Sheet HYS72T[64/128/256]4[00/20]HFD-[3S/3.7]-A 6 SPD Codes This chapter lists all hexadecimal byte values stored in the EEPROM of the products described in this data sheet. SPD stands for serial presence detect. All values with XX in the table are module specific bytes which are defined during production. List of SPD Code Tables * Table 16 "PC2-5300F-555" on Page 25 * Table 17 "PC2-4200F-444" on Page 30 TABLE 16 PC2-5300F-555 HYS72T128420HFD-3S-A HYS72T64400HFD-3S-A Product Type HYS72T256420HFD-3S-A 2 GByte x72 2 Ranks (x4) PC2-5300F-555 Rev. 1.1 HEX 92 11 09 12 48 23 07 10 00 01 04 0C 20 33 Organization 512MB x72 1 Rank (x8) 1 GByte x72 2 Ranks (x8) PC2-5300F-555 Rev. 1.1 HEX 92 11 09 12 44 23 07 11 00 01 04 0C 20 33 Label Code JEDEC SPD Revision Byte# 0 1 2 3 4 5 6 7 8 9 10 11 12 13 Description SPD Size CRC / Total / Used SPD Revision Key Byte / DRAM Device Type Voltage Level of this Assembly SDRAM Addressing Module Physical Attributes Module Type Module Organization Fine Timebase (FTB) Dividend and Divisor Medium Timebase (MTB) Dividend Medium Timebase (MTB) Divisor PC2-5300F-555 Rev. 1.1 HEX 92 11 09 12 44 23 07 09 00 01 04 0C 20 33 tCK.MIN (min. SDRAM Cycle Time) tCK.MAX (max. SDRAM Cycle Time) CAS Latencies Supported Rev. 1.2, 2006-11 03292006-GUME-ERC3 25 Internet Data Sheet HYS72T[64/128/256]4[00/20]HFD-[3S/3.7]-A HYS72T128420HFD-3S-A Organization 512MB x72 1 Rank (x8) HYS72T64400HFD-3S-A Product Type 1 GByte x72 2 Ranks (x8) PC2-5300F-555 Rev. 1.1 HEX 3C 42 3C 72 50 3C 1E 3C 00 B4 F0 A4 01 1E 1E 03 07 01 C2 53 78 48 2E 26 26 4A 2 GByte x72 2 Ranks (x4) PC2-5300F-555 Rev. 1.1 HEX 3C 42 3C 72 50 3C 1E 3C 00 B4 F0 A4 01 1E 1E 03 07 01 C2 53 78 48 2E 26 26 4A Label Code JEDEC SPD Revision Byte# 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 Description PC2-5300F-555 Rev. 1.1 HEX 3C 42 3C 72 50 3C 1E 3C 00 B4 F0 A4 01 1E 1E 03 07 01 C2 53 78 48 2E 26 26 4A tCAS.MIN (min. CAS Latency Time) Write Recovery Values Supported (WR) tWR.MIN (Write Recovery Time) Write Latency Times Supported Additive Latency Times Supported tRCD.MIN (min. RAS# to CAS# Delay) tRRD.MIN (min. Row Active to Row Active Delay) tRP.MIN (min. Row Precharge Time) tRAS and tRC Extension tRAS.MIN (min. Active to Precharge Time) tRC.MIN (min. Active to Active / Refresh Time) tRFC.MIN LSB (min. Refresh Recovery Time Delay) tRFC.MIN MSB (min. Refresh Recovery Time Delay) tWTR.MIN (min. Internal Write to Read Cmd Delay) tRTP.MIN (min. Internal Read to Precharge Cmd Delay) Burst Lengths Supported Terminations Supported Drive Strength Supported tREFI (avg. SDRAM Refresh Period) TCASE.MAX Delta / T4R4W Delta Psi(T-A) DRAM T0 (DT0) DRAM T2Q (DT2Q) DRAM T2P (DT2P) DRAM T3N (DT3N) DRAM T4R (DT4R) / T4R4W Sign (DT4R4W) DRAM Rev. 1.2, 2006-11 03292006-GUME-ERC3 26 HYS72T256420HFD-3S-A Internet Data Sheet HYS72T[64/128/256]4[00/20]HFD-[3S/3.7]-A HYS72T128420HFD-3S-A Organization 512MB x72 1 Rank (x8) HYS72T64400HFD-3S-A Product Type 1 GByte x72 2 Ranks (x8) PC2-5300F-555 Rev. 1.1 HEX 20 22 00 22 00 02 00 00 36 36 34 2A 56 6B 5C 91 76 00 00 1F CA 00 40 C0 12 44 2 GByte x72 2 Ranks (x4) PC2-5300F-555 Rev. 1.1 HEX 20 22 00 22 00 02 00 00 36 36 34 2A 62 77 61 9F 84 00 00 1F CA 00 40 C0 12 44 Label Code JEDEC SPD Revision Byte# 40 41 42 - 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 - 97 98 99 100 101 102 103 104 Description T5B (DT5B) DRAM T7 (DT7) DRAM Not used FBDIMM ODT Values Not used Channel Protocols Supported LSB Channel Protocols Supported MSB Back-to-Back Access Turnaround Time AMB Read Access Delay for DDR2-800 AMB Read Access Delay for DDR2-667 AMB Read Access Delay for DDR2-533 Psi(T-A) AMB TIdle_0 (DT Idle_0) AMB TIdle_1 (DT Idle_1) AMB TIdle_2 (DT Idle_2) AMB TActive_1 (DT Active_1) AMB TActive_2 (DT Active_2) AMB TL0s (DT L0s) AMB Not used AMB Junction Temperature Maximum (Tjmax) Category Byte Not used AMB Personality Bytes: Pre-initialization (1) AMB Personality Bytes: Pre-initialization (2) AMB Personality Bytes: Pre-initialization (3) AMB Personality Bytes: Pre-initialization (4) PC2-5300F-555 Rev. 1.1 HEX 20 22 00 01 00 02 00 00 36 36 34 2A 56 6B 5C 91 76 00 00 1F CA 00 40 C0 12 44 Rev. 1.2, 2006-11 03292006-GUME-ERC3 27 HYS72T256420HFD-3S-A Internet Data Sheet HYS72T[64/128/256]4[00/20]HFD-[3S/3.7]-A HYS72T128420HFD-3S-A Organization 512MB x72 1 Rank (x8) HYS72T64400HFD-3S-A Product Type 1 GByte x72 2 Ranks (x8) PC2-5300F-555 Rev. 1.1 HEX 9C 30 60 33 60 1B 60 1B 60 1B 80 B3 85 51 xx xx xx xx D0 DD 37 32 54 31 32 2 GByte x72 2 Ranks (x4) PC2-5300F-555 Rev. 1.1 HEX 9C 30 60 33 60 1B 60 1B 60 1B 80 B3 85 51 xx xx xx xx 09 68 37 32 54 32 35 Label Code JEDEC SPD Revision Byte# 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 125 126 127 128 129 130 131 132 Description AMB Personality Bytes: Pre-initialization (5) AMB Personality Bytes: Pre-initialization (6) AMB Personality Bytes: Post-initialization (1) AMB Personality Bytes: Post-initialization (2) AMB Personality Bytes: Post-initialization (3) AMB Personality Bytes: Post-initialization (4) AMB Personality Bytes: Post-initialization (5) AMB Personality Bytes: Post-initialization (6) AMB Personality Bytes: Post-initialization (7) AMB Personality Bytes: Post-initialization (8) AMB Manufacturers JEDEC ID Code LSB AMB Manufacturers JEDEC ID Code MSB DIMM Manufacturers JEDEC ID Code LSB DIMM Manufacturers JEDEC ID Code MSB Module Manufacturing Location Module Manufacturing Date Year Module Manufacturing Date Week Module Serial Number Cyclical Redundancy Code LSB Cyclical Redundancy Code MSB Module Product Type, Char #1 Module Product Type, Char #2 Module Product Type, Char #3 Module Product Type, Char #4 Module Product Type, Char #5 PC2-5300F-555 Rev. 1.1 HEX 9C 30 60 33 60 1B 60 1B 60 1B 80 B3 85 51 xx xx xx xx EC D5 37 32 54 36 34 Rev. 1.2, 2006-11 03292006-GUME-ERC3 28 HYS72T256420HFD-3S-A Internet Data Sheet HYS72T[64/128/256]4[00/20]HFD-[3S/3.7]-A HYS72T128420HFD-3S-A Organization 512MB x72 1 Rank (x8) HYS72T64400HFD-3S-A Product Type 1 GByte x72 2 Ranks (x8) PC2-5300F-555 Rev. 1.1 HEX 38 34 32 30 48 46 44 33 53 41 20 20 20 7x xx 85 51 01 05 00 FF 2 GByte x72 2 Ranks (x4) PC2-5300F-555 Rev. 1.1 HEX 36 34 32 30 48 46 44 33 53 41 20 20 20 7x xx 85 51 01 05 00 FF Label Code JEDEC SPD Revision Byte# 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 175 176 255 Description Module Product Type, Char #6 Module Product Type, Char #7 Module Product Type, Char #8 Module Product Type, Char #9 Module Product Type, Char #10 Module Product Type, Char #11 Module Product Type, Char #12 Module Product Type, Char #13 Module Product Type, Char #14 Module Product Type, Char #15 Module Product Type, Char #16 Module Product Type, Char #17 Module Product Type, Char #18 Module Revision Code Test Program Revision Code DRAM Manufacturers JEDEC ID Code LSB DRAM Manufacturers JEDEC ID Code MSB informal AMB content revision tag (MSB) informal AMB content revision tag (LSB) Not used Blank for customer use PC2-5300F-555 Rev. 1.1 HEX 34 30 30 48 46 44 33 53 41 20 20 20 20 7x xx 85 51 01 05 00 FF Rev. 1.2, 2006-11 03292006-GUME-ERC3 29 HYS72T256420HFD-3S-A Internet Data Sheet HYS72T[64/128/256]4[00/20]HFD-[3S/3.7]-A TABLE 17 PC2-4200F-444 HYS72T128420HFD-3.7-A HYS72T64400HFD-3.7-A Product Type HYS72T256420HFD-3.7-A 2 GByte x72 2 Ranks (x4) PC2-4200F-444 Rev. 1.1 HEX 92 11 09 12 48 23 07 10 00 01 04 0F 20 33 3C 32 3C 72 50 3C 1E 3C 00 Organization 512MB x72 1 Rank (x8) 1 GByte x72 2 Ranks (x8) PC2-4200F-444 Rev. 1.1 HEX 92 11 09 12 44 23 07 11 00 01 04 0F 20 33 3C 32 3C 72 50 3C 1E 3C 00 Label Code JEDEC SPD Revision Byte# 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 Description SPD Size CRC / Total / Used SPD Revision Key Byte / DRAM Device Type Voltage Level of this Assembly SDRAM Addressing Module Physical Attributes Module Type Module Organization Fine Timebase (FTB) Dividend and Divisor Medium Timebase (MTB) Dividend Medium Timebase (MTB) Divisor PC2-4200F-444 Rev. 1.1 HEX 92 11 09 12 44 23 07 09 00 01 04 0F 20 33 3C 32 3C 72 50 3C 1E 3C 00 tCK.MIN (min. SDRAM Cycle Time) tCK.MAX (max. SDRAM Cycle Time) CAS Latencies Supported tCAS.MIN (min. CAS Latency Time) Write Recovery Values Supported (WR) tWR.MIN (Write Recovery Time) Write Latency Times Supported Additive Latency Times Supported tRCD.MIN (min. RAS# to CAS# Delay) tRRD.MIN (min. Row Active to Row Active Delay) tRP.MIN (min. Row Precharge Time) tRAS and tRC Extension Rev. 1.2, 2006-11 03292006-GUME-ERC3 30 Internet Data Sheet HYS72T[64/128/256]4[00/20]HFD-[3S/3.7]-A HYS72T128420HFD-3.7-A Organization 512MB x72 1 Rank (x8) HYS72T64400HFD-3.7-A Product Type 1 GByte x72 2 Ranks (x8) PC2-4200F-444 Rev. 1.1 HEX B4 F0 A4 01 1E 1E 03 07 01 C2 51 78 3C 22 1E 1E 34 1E 20 00 22 00 02 00 00 36 2 GByte x72 2 Ranks (x4) PC2-4200F-444 Rev. 1.1 HEX B4 F0 A4 01 1E 1E 03 07 01 C2 51 78 3C 22 1E 1E 34 1E 20 00 22 00 02 00 00 36 Label Code JEDEC SPD Revision Byte# 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 - 78 79 80 81 82 83 84 Description PC2-4200F-444 Rev. 1.1 HEX B4 F0 A4 01 1E 1E 03 07 01 C2 51 78 3C 22 1E 1E 34 1E 20 00 01 00 02 00 00 36 tRAS.MIN (min. Active to Precharge Time) tRC.MIN (min. Active to Active / Refresh Time) tRFC.MIN LSB (min. Refresh Recovery Time Delay) tRFC.MIN MSB (min. Refresh Recovery Time Delay) tWTR.MIN (min. Internal Write to Read Cmd Delay) tRTP.MIN (min. Internal Read to Precharge Cmd Delay) Burst Lengths Supported Terminations Supported Drive Strength Supported tREFI (avg. SDRAM Refresh Period) TCASE.MAX Delta / T4R4W Delta Psi(T-A) DRAM T0 (DT0) DRAM T2Q (DT2Q) DRAM T2P (DT2P) DRAM T3N (DT3N) DRAM T4R (DT4R) / T4R4W Sign (DT4R4W) DRAM T5B (DT5B) DRAM T7 (DT7) DRAM Not used FBDIMM ODT Values Not used Channel Protocols Supported LSB Channel Protocols Supported MSB Back-to-Back Access Turnaround Time AMB Read Access Delay for DDR2-800 Rev. 1.2, 2006-11 03292006-GUME-ERC3 31 HYS72T256420HFD-3.7-A Internet Data Sheet HYS72T[64/128/256]4[00/20]HFD-[3S/3.7]-A HYS72T128420HFD-3.7-A Organization 512MB x72 1 Rank (x8) HYS72T64400HFD-3.7-A Product Type 1 GByte x72 2 Ranks (x8) PC2-4200F-444 Rev. 1.1 HEX 36 34 2A 4C 61 50 82 69 00 00 1F CA 00 40 C0 12 44 9C 30 60 33 60 1B 60 1B 60 2 GByte x72 2 Ranks (x4) PC2-4200F-444 Rev. 1.1 HEX 36 34 2A 58 6B 54 91 78 00 00 1F CA 00 40 C0 12 44 9C 30 60 33 60 1B 60 1B 60 Label Code JEDEC SPD Revision Byte# 85 86 87 88 89 90 91 92 93 94 - 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 Description AMB Read Access Delay for DDR2-667 AMB Read Access Delay for DDR2-533 Psi(T-A) AMB TIdle_0 (DT Idle_0) AMB TIdle_1 (DT Idle_1) AMB TIdle_2 (DT Idle_2) AMB TActive_1 (DT Active_1) AMB TActive_2 (DT Active_2) AMB TL0s (DT L0s) AMB Not used AMB Junction Temperature Maximum (Tjmax) Category Byte Not used AMB Personality Bytes: Pre-initialization (1) AMB Personality Bytes: Pre-initialization (2) AMB Personality Bytes: Pre-initialization (3) AMB Personality Bytes: Pre-initialization (4) AMB Personality Bytes: Pre-initialization (5) AMB Personality Bytes: Pre-initialization (6) AMB Personality Bytes: Post-initialization (1) AMB Personality Bytes: Post-initialization (2) AMB Personality Bytes: Post-initialization (3) AMB Personality Bytes: Post-initialization (4) AMB Personality Bytes: Post-initialization (5) AMB Personality Bytes: Post-initialization (6) AMB Personality Bytes: Post-initialization (7) PC2-4200F-444 Rev. 1.1 HEX 36 34 2A 4C 61 50 82 69 00 00 1F CA 00 40 C0 12 44 9C 30 60 33 60 1B 60 1B 60 Rev. 1.2, 2006-11 03292006-GUME-ERC3 32 HYS72T256420HFD-3.7-A Internet Data Sheet HYS72T[64/128/256]4[00/20]HFD-[3S/3.7]-A HYS72T128420HFD-3.7-A Organization 512MB x72 1 Rank (x8) HYS72T64400HFD-3.7-A Product Type 1 GByte x72 2 Ranks (x8) PC2-4200F-444 Rev. 1.1 HEX 1B 80 B3 85 51 xx xx xx xx C4 AE 37 32 54 31 32 38 34 32 30 48 46 44 33 2E 2 GByte x72 2 Ranks (x4) PC2-4200F-444 Rev. 1.1 HEX 1B 80 B3 85 51 xx xx xx xx F9 13 37 32 54 32 35 36 34 32 30 48 46 44 33 2E Label Code JEDEC SPD Revision Byte# 114 115 116 117 118 119 120 121 122 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 Description AMB Personality Bytes: Post-initialization (8) AMB Manufacturers JEDEC ID Code LSB AMB Manufacturers JEDEC ID Code MSB DIMM Manufacturers JEDEC ID Code LSB DIMM Manufacturers JEDEC ID Code MSB Module Manufacturing Location Module Manufacturing Date Year Module Manufacturing Date Week Module Serial Number Cyclical Redundancy Code LSB Cyclical Redundancy Code MSB Module Product Type, Char #1 Module Product Type, Char #2 Module Product Type, Char #3 Module Product Type, Char #4 Module Product Type, Char #5 Module Product Type, Char #6 Module Product Type, Char #7 Module Product Type, Char #8 Module Product Type, Char #9 Module Product Type, Char #10 Module Product Type, Char #11 Module Product Type, Char #12 Module Product Type, Char #13 Module Product Type, Char #14 PC2-4200F-444 Rev. 1.1 HEX 1B 80 B3 85 51 xx xx xx xx F8 A6 37 32 54 36 34 34 30 30 48 46 44 33 2E 37 Rev. 1.2, 2006-11 03292006-GUME-ERC3 33 HYS72T256420HFD-3.7-A Internet Data Sheet HYS72T[64/128/256]4[00/20]HFD-[3S/3.7]-A HYS72T128420HFD-3.7-A Organization 512MB x72 1 Rank (x8) HYS72T64400HFD-3.7-A Product Type 1 GByte x72 2 Ranks (x8) PC2-4200F-444 Rev. 1.1 HEX 37 41 20 20 7x xx 85 51 01 05 00 FF 2 GByte x72 2 Ranks (x4) PC2-4200F-444 Rev. 1.1 HEX 37 41 20 20 7x xx 85 51 01 05 00 FF Label Code JEDEC SPD Revision Byte# 142 143 144 145 146 147 148 149 150 151 152 175 176 255 Description Module Product Type, Char #15 Module Product Type, Char #16 Module Product Type, Char #17 Module Product Type, Char #18 Module Revision Code Test Program Revision Code DRAM Manufacturers JEDEC ID Code LSB DRAM Manufacturers JEDEC ID Code MSB informal AMB content revision tag (MSB) informal AMB content revision tag (LSB) Not used Blank for customer use PC2-4200F-444 Rev. 1.1 HEX 41 20 20 20 7x xx 85 51 01 05 00 FF Rev. 1.2, 2006-11 03292006-GUME-ERC3 34 HYS72T256420HFD-3.7-A Internet Data Sheet HYS72T[64/128/256]4[00/20]HFD-[3S/3.7]-A 7 Package Outline near the device power pins. The AMB device in the center of the DIMM has a metal Heat Sink. The FB-DIMM mechanical outlines are consistent with JEDEC MO-256. All Components are surface mounted on one or both sides of the PCB and positioned on the PCB to meet the minimum and maximum trace lengths required for DDR2 SDRAM signals. Bypass capacitors for DDR2 SDRAM devices are located TABLE 18 Raw Card Reference JEDEC Raw Card PCB Dimensions Width [mm] R/C A R/C B R/C H L-DIM-240-21 L-DIM-240-22 L-DIM-240-25 Figure 4 Figure 5 Figure 6 133.35 133.35 133.35 Height [mm] 30.35 30.35 30.35 Thickness [mm] 8.2 8.2 8.2 Note 1) 1) 1) 1) Thickness includes Qimonda Heat Sink. Some early production modules with Jedec Heatspreader may be thicker up to 8.2mm. Attention: Heat Sink heat up during operation. When unplugging a DIMM from a system direct skin contact should be avoided until the Heat Sink has reached room temperature. Attention: The Heat Sink is mechanically loaded. Do not remove. Removal of the clip may cause injuries. Attention: Any mechanical stress on the Heat Sink should be avoided. Touching the Heat Sink while plugging or unplugging the module may permanently damage the DIMM. Rev. 1.2, 2006-11 03292006-GUME-ERC3 35 Internet Data Sheet HYS72T[64/128/256]4[00/20]HFD-[3S/3.7]-A FIGURE 4 Package Outline L-DIM-240-21 with Full Heat Sink Notes 1. Please contact your sales or marketing representative for more details on package dimensions. 2. Drawing according to ISO 8015 3. Dimensions in mm 4. General tolerances +/- 0.15 Rev. 1.2, 2006-11 03292006-GUME-ERC3 36 Internet Data Sheet HYS72T[64/128/256]4[00/20]HFD-[3S/3.7]-A FIGURE 5 Package Outline L-DIM-240-22 with Full Heat Sink Notes 1. Please contact your sales or marketing representative for more details on package dimensions. 2. Drawing according to ISO 8015 3. Dimensions in mm 4. General tolerances +/- 0.15 Rev. 1.2, 2006-11 03292006-GUME-ERC3 37 Internet Data Sheet HYS72T[64/128/256]4[00/20]HFD-[3S/3.7]-A FIGURE 6 Package Outline L-DIM-240-25 with Full Heat Sink Notes 1. Please contact your sales or marketing representative for more details on package dimensions. 2. Drawing according to ISO 8015 3. Dimensions in mm 4. General tolerances +/- 0.15 Rev. 1.2, 2006-11 03292006-GUME-ERC3 38 Internet Data Sheet HYS72T[64/128/256]4[00/20]HFD-[3S/3.7]-A 8 DDR2 Nomenclature TABLE 19 Nomenclature Fields and Examples Example for Field Number 1 2 64 18 3 T T 4 64128 5121G 5 0 16 6 2 7 0 0 8 K A 9 M C 10 -5 -5 11 -A -- Micro-DIMM DDR2 DRAM HYS HYB TABLE 20 DDR2 DIMM Nomenclature Field 1 2 3 4 Description Module Prefix Module Data Width [bit] DRAM Technology Memory Density per I/O [Mbit]; Module Density1) Values HYS 64 72 T 32 64 128 256 512 5 6 7 8 9 Raw Card Generation Number of Module Ranks Product Variations Package, Lead-Free Status Module Type 0 .. 9 0, 2, 4 0 .. 9 A .. Z D M R U F 10 Speed Grade -2.5 -3 -3S -3.7 -5 Coding Constant Non-ECC ECC DDR2 256 MByte 512 MByte 1 GByte 2 GByte 4 GByte Look up table 1, 2, 4 Look up table Look up table SO-DIMM Micro-DIMM Registered Unbuffered Fully Buffered PC2-6400 6-6-6 PC2-5300 4-4-4 PC2-5300 5-5-5 PC2-4200 4-4-4 PC2-3200 3-3-3 Rev. 1.2, 2006-11 03292006-GUME-ERC3 39 Internet Data Sheet HYS72T[64/128/256]4[00/20]HFD-[3S/3.7]-A Field 11 Description Die Revision Values -A -B Coding First Second 1) Multiplying "Memory Density per I/O" with "Module Data Width" and dividing by 8 for Non-ECC and 9 for ECC modules gives the overall module memory density in MBytes as listed in column "Coding". TABLE 21 DDR2 DRAM Nomenclature Field 1 2 3 4 Description Component Prefix Interface Voltage [V] DRAM Technology Component Density [Mbit] Values HYB 18 T 256 512 1G 2G 5+6 Number of I/Os 40 80 16 7 8 9 Product Variations Die Revision Package, Lead-Free Status Speed Grade 0 .. 9 A B C F 10 -2.5 -3 -3S -3.7 -5 Coding Constant SSTL_18 DDR2 256 Mbit 512 Mbit 1 Gbit 2 Gbit x4 x8 x16 Look up table First Second FBGA, lead-containing FBGA, lead-free DDR2-800 6-6-6 DDR2-667 4-4-4 DDR2-667 5-5-5 DDR2-533 4-4-4 DDR2-400 3-3-3 Rev. 1.2, 2006-11 03292006-GUME-ERC3 40 Internet Data Sheet HYS72T[64/128/256]4[00/20]HFD-[3S/3.7]-A Table of Contents 1 1.1 1.2 2 3 3.1 3.2 3.3 3.3.1 3.3.2 3.3.3 3.3.4 3.4 3.5 3.6 4 4.1 5 5.1 6 7 8 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Basic Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Advanced Memory Buffer Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . High-Speed Differential Point-to-Point Link (at 1.5 V) Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DDR2 Channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SMBus Slave Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Channel Latency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Peak Theoretical Channel Throughput . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hot-add . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hot-remove . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hot-replace . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 12 12 14 14 14 14 15 15 15 15 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Current Spec. and Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 ICC/IDD Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 SPD Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 DDR2 Nomenclature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Rev. 1.2, 2006-11 03292006-GUME-ERC3 41 Internet Data Sheet Edition 2006-11 Published by Qimonda AG Gustav-Heinemann-Ring 212 D-81739 Munchen, Germany (c) Qimonda AG 2006. All Rights Reserved. Legal Disclaimer The information given in this Internet Data Sheet shall in no event be regarded as a guarantee of conditions or characteristics ("Beschaffenheitsgarantie"). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Qimonda hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Qimonda Office. Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Qimonda Office. Qimonda Components may only be used in life-support devices or systems with the express written approval of Qimonda, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. www.qimonda.com |
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